Fabrication device for bonding layer, double-sided board, and multi-layer board

This prevention discloses devices for bonding layer, double-sided board and multi-layer board fabrication. It provides precise, highly efficient and without electro-plating process for bonding layer, double-sided board and multi-layer board.

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Bibliographic Details
Main Authors KATO, KANJI, HAYASHI, HIDENORI, OCHI, AKIO, TANIZAKI, TOSHIO, WADA, AKIRA
Format Patent
LanguageEnglish
Published 21.04.2000
Edition7
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PERFORMING OPERATIONS
PRINTED CIRCUITS
TRANSPORTING
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Summary:This prevention discloses devices for bonding layer, double-sided board and multi-layer board fabrication. It provides precise, highly efficient and without electro-plating process for bonding layer, double-sided board and multi-layer board.
Bibliography:Application Number: TW199887106315