Conditioner and conditioning disk for a CMP pad, and method of fabricating, reworking, and cleaning conditioning disk

• Main Authors: CHO, SUNG-BUM, KIM, JIN-SUNG, SAI, KEISO, CHOI, BAIK-SOON
• Format: Patent
• Language: English
• Published: 01.03.2000
• Edition: 7
• Subjects: BASIC ELECTRIC ELEMENTS; DRESSING OR CONDITIONING OF ABRADING SURFACES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GRINDING; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; PERFORMING OPERATIONS; POLISHING; SEMICONDUCTOR DEVICES; TOOLS FOR GRINDING, BUFFING, OR SHARPENING; TRANSPORTING

There are provided a conditioning disk and a conditioner for a chemical mechanical polishing (CMP) pad, and a method of fabricating, reworking, and cleaning the conditioning disk for improving the conditioning efficiency, and saving the production expenses. The conditioning disk for a CMP pad is characterized to be divided into regions according to the size difference of abrasive grains formed on the body surface of the conditioning disk. The method of fabricating the conditioning disk is performed by forming adhesive films for attaching the abrasive grains on the body surface of the conditioning disk repeatedly in multiple times. In addition, the used conditioning disk may be reused by detaching the abrasive grains from the body, and performing the above fabrication method. By-products on the body surface of the used conditioning disk can be removed by the cleaning method of the present invention by immersing the used conditioning disk in a HF solution or BOE (buffered oxide etch) solution.