Manufacturing method for hard substrate and manufacturing apparatus thereof

• Main Authors: HASHIGUCHI, ERIKO, KAWATE, KENJI
• Format: Patent
• Language: English
• Published: 21.01.2000
• Edition: 7
• Subjects: BASIC ELECTRIC ELEMENTS; DRESSING OR CONDITIONING OF ABRADING SURFACES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GRINDING; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; PERFORMING OPERATIONS; POLISHING; SEMICONDUCTOR DEVICES; TRANSPORTING

The invention provides a kind of manufacturing method for hard substrate and manufacturing apparatus which combines the advantages of both contact polishing with the polishing portion and floating polishing by slurry so that the surface defects can be greatly improved. The polishing process is proce...