Manufacturing method for hard substrate and manufacturing apparatus thereof

The invention provides a kind of manufacturing method for hard substrate and manufacturing apparatus which combines the advantages of both contact polishing with the polishing portion and floating polishing by slurry so that the surface defects can be greatly improved. The polishing process is proce...

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Bibliographic Details
Main Authors HASHIGUCHI, ERIKO, KAWATE, KENJI
Format Patent
LanguageEnglish
Published 21.01.2000
Edition7
Subjects
BASIC ELECTRIC ELEMENTS
DRESSING OR CONDITIONING OF ABRADING SURFACES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
SEMICONDUCTOR DEVICES
TRANSPORTING
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Summary:The invention provides a kind of manufacturing method for hard substrate and manufacturing apparatus which combines the advantages of both contact polishing with the polishing portion and floating polishing by slurry so that the surface defects can be greatly improved. The polishing process is proceeded after the load is applied on the workpiece by the holder. When the contact polishing is over, close the ejection valve and there will be sump of slurry formed on the polishing portion. Then, to remove the load by the holder so the workpiece can be slowly detached from the polishing portion and keep staying at the position where a water film is formed between the workpiece and polishing portion. Then, to proceed the floating polishing for the workpiece detaching from the polishing portion and apply horizontal vibration from the center of location plate to the outer rim. Then, supply the cleansing liquid on the polishing portion to replace the slurry.
Bibliography:Application Number: TW19970114408