Packing materials for small parts, packing method and packing apparatus as well as the packing method for electronic parts

The present invention concerns a low-cost and easily operative packing material for small parts, packing method and packing apparatus as well as the packing method for electronic parts by providing a packing material for small parts 20 having a plurality of housing cavities 14 disposed longitudinall...

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Bibliographic Details
Main Authors ICHITENMANYA, EIJI, TANAKA, KURAHEI, TOMII, UZOU, ASAO, YUKIHIKO, MORI, KAZUHIRO
Format Patent
LanguageEnglish
Published 11.01.2000
Edition7
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Summary:The present invention concerns a low-cost and easily operative packing material for small parts, packing method and packing apparatus as well as the packing method for electronic parts by providing a packing material for small parts 20 having a plurality of housing cavities 14 disposed longitudinally for housing small parts 20 before covering the surface of the housing cavities 14 with a covering tape 14, having: the tape comprising compressed and winding material; and the housing cavities 14 formed on the surface compressed in the direction of thickness and compressed in rated depth.
Bibliography:Application Number: TW19980110271