Resin packaging mold for semiconductor apparatus

• Main Author: HIGUCHI, NORIAKI
• Format: Patent
• Language: Chinese; English
• Published: 01.07.1999
• Subjects: AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES; PERFORMING OPERATIONS; SEMICONDUCTOR DEVICES; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; TECHNICAL SUBJECTS COVERED BY FORMER USPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ARTCOLLECTIONS [XRACs] AND DIGESTS; TRANSPORTING; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

A kind of resin packaging mold for semiconductor apparatus that during the packaging process there will be no leakage even employing the low viscosity resin. The mold comprises the mold cavity element which is used to allocate lead frames carrying the semiconductor components; and the gate component which includes the gate portion of resin injection for sealing the said semiconductor component; and only the gate portion is replaceable and leakage-resistant dam is allocated along the subsidiary runner such that the subsidiary runner can prevent the leaked resin from flowing to the lead wires.