Wafer sawing apparatus

• Main Authors: JANG, SAM-BOK, KANG, HYEON-GU, JANG, DONG-SUNG, SUN, YONG-KYUN
• Format: Patent
• Language: Chinese; English
• Published: 21.06.1999
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; PERFORMING OPERATIONS; SEMICONDUCTOR DEVICES; TRANSPORTING; WORKING CEMENT, CLAY, OR STONE; WORKING STONE OR STONE-LIKE MATERIALS

There is provided a wafer sawing apparatus for scribing a wafer having a plurality of IC s which are separated from each other by a plurality of streets to give individual IC s, the wafer sawing apparatus comprising a scribing blade which revolves and moves along the streets; an ejection means composed of two side nozzles and a center nozzle, the side nozzles which are positioned on both sides of the scribing blade and eject a washing solution to the scribing blade and a top surface of the wafer with a designated angle, and the center nozzle which is positioned on the front of a driving direction of the scribing blade and ejects the washing solution to the scribing blade and the top surface of the wafer with a designated angle; and a suction means for sucking silicon particulates from the top surface of the wafer, where the particulates are produced from the top surface of the wafer, where the particulates are produced from the wafer by the scribing blade. The wafer sawing apparatus according to the present i