Device for detecting defective joint in a semiconductor

• Main Author: INOUE MIWA
• Format: Patent
• Language: Chinese; English
• Published: 21.12.1998
• Subjects: BASIC ELECTRIC ELEMENTS; DEAF-AID SETS; ELECTRIC COMMUNICATION TECHNIQUE; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES; LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKEACOUSTIC ELECTROMECHANICAL TRANSDUCERS; MEASURING; PHYSICS; PUBLIC ADDRESS SYSTEMS; SEMICONDUCTOR DEVICES; TESTING

A device for detecting a defective joint in a semiconductor, which is connected to a line joint machine which performs joining by ultrasonic waves generated by an ultrasonic wave oscillator, which is characterized in comprising: means for sampling voltage waveforms and current waveforms from the ultrasonic oscillator during the joining process and applying a digital conversion; digital signal processing means for calculating the specific data consisting of the phase differences of the voltage waveforms and the current waveforms, impedance, etc. from the digitally converted sample data of the voltage waveforms and the current waveforms; data storage means for storing the digital data of the digital signal processing means; and determination means for determining a defective joint by comparing a past average value of plural digital data stored in the data storage means with the current digital data calculated by the digital signal processing means.