Sensor noise reduction and manufacturing methods
Noise reduction and manufacturing methods for sensors of an electronic device are disclosed. In some embodiments, the device comprises a lid comprising an opening covered by a window cap. In some embodiments, the device comprises pressure sensors. In some embodiments, a method comprises induction he...
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Main Authors | , , , , , , , |
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Format | Patent |
Language | Chinese English |
Published |
16.07.2024
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Subjects | |
Online Access | Get full text |
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Summary: | Noise reduction and manufacturing methods for sensors of an electronic device are disclosed. In some embodiments, the device comprises a lid comprising an opening covered by a window cap. In some embodiments, the device comprises pressure sensors. In some embodiments, a method comprises induction heating for bonding the device. In some embodiments, a method comprises averaging readout values of successive frames from the sensors. In some embodiments, a method comprises reading out the sensors at a first frequency during a first time period and at a second frequency during a second time period. In some embodiments, residue filaments are attached to the sensors. In some embodiments, the device is thermally isolated from a housing of the device. In some embodiments, the device comprises sensors for measuring temperature. In some embodiments, the device comprises a bias voltage generator for providing a bias voltage to the sensors. |
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Bibliography: | Application Number: TW202312134072 |