Sensor noise reduction and manufacturing methods

Noise reduction and manufacturing methods for sensors of an electronic device are disclosed. In some embodiments, the device comprises a lid comprising an opening covered by a window cap. In some embodiments, the device comprises pressure sensors. In some embodiments, a method comprises induction he...

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Main Authors ANDREWS, SEAN, LEWIS, ALAN, CHAN, EDWARD, WEN, BING, HONG, JOHN, CHANG, TALLIS, HONG, JEREMY, SHIN, HEE-SUN
Format Patent
LanguageChinese
English
Published 16.07.2024
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Summary:Noise reduction and manufacturing methods for sensors of an electronic device are disclosed. In some embodiments, the device comprises a lid comprising an opening covered by a window cap. In some embodiments, the device comprises pressure sensors. In some embodiments, a method comprises induction heating for bonding the device. In some embodiments, a method comprises averaging readout values of successive frames from the sensors. In some embodiments, a method comprises reading out the sensors at a first frequency during a first time period and at a second frequency during a second time period. In some embodiments, residue filaments are attached to the sensors. In some embodiments, the device is thermally isolated from a housing of the device. In some embodiments, the device comprises sensors for measuring temperature. In some embodiments, the device comprises a bias voltage generator for providing a bias voltage to the sensors.
Bibliography:Application Number: TW202312134072