Adhesive film, adhesive tape, adhesive tape with release film, semiconductor device manufacturing method and semiconductor device

Provided is an adhesive film that is used to join a semiconductor chip to a substrate and to seal the gap between the semiconductor chip and the substrate, wherein the adhesive film is a single-layer film comprising an adhesive composition having photosetting properties and thermosetting properties.

Saved in:
Bibliographic Details
Main Authors ISHIGE, HIROYUKI, HAYASHIDE, AKIKO, KIMURA, RYOSUKE, TAZAWA, TSUYOSHI
Format Patent
LanguageChinese
English
Published 16.07.2024
Subjects
ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
BASIC ELECTRIC ELEMENTS
CHEMISTRY
DYES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
PAINTS
POLISHES
SEMICONDUCTOR DEVICES
USE OF MATERIALS AS ADHESIVES
Online AccessGet full text

Cover

More Information
Summary:Provided is an adhesive film that is used to join a semiconductor chip to a substrate and to seal the gap between the semiconductor chip and the substrate, wherein the adhesive film is a single-layer film comprising an adhesive composition having photosetting properties and thermosetting properties.
Bibliography:Application Number: TW202312124832