Adhesive film, adhesive tape, adhesive tape with release film, semiconductor device manufacturing method and semiconductor device

Provided is an adhesive film that is used to join a semiconductor chip to a substrate and to seal the gap between the semiconductor chip and the substrate, wherein the adhesive film is a single-layer film comprising an adhesive composition having photosetting properties and thermosetting properties.

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Bibliographic Details
Main Authors ISHIGE, HIROYUKI, HAYASHIDE, AKIKO, KIMURA, RYOSUKE, TAZAWA, TSUYOSHI
Format Patent
LanguageChinese
English
Published 16.07.2024
Subjects
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Summary:Provided is an adhesive film that is used to join a semiconductor chip to a substrate and to seal the gap between the semiconductor chip and the substrate, wherein the adhesive film is a single-layer film comprising an adhesive composition having photosetting properties and thermosetting properties.
Bibliography:Application Number: TW202312124832