Polishing pad conditioning device

The present invention provides a polishing pad conditioning device, comprising: a substrate; and a plurality of first cleaning units and a plurality of second cleaning units, which are arranged above the substrate; wherein each of the first cleaning unit comprises a plurality of first brushes arrang...

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Bibliographic Details
Main Authors CHANG, CHE-YUAN, TANG, CHUN-KAI, SU, XUE-SHEN
Format Patent
LanguageChinese
English
Published 16.07.2024
Subjects
DRESSING OR CONDITIONING OF ABRADING SURFACES
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
TRANSPORTING
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Summary:The present invention provides a polishing pad conditioning device, comprising: a substrate; and a plurality of first cleaning units and a plurality of second cleaning units, which are arranged above the substrate; wherein each of the first cleaning unit comprises a plurality of first brushes arranged in parallel, and the plurality of first brushes are arranged perpendicular to the substrate or formed a first angle with the substrate; wherein each of the second cleaning units comprises a plurality of second brushes arranged in parallel, and the plurality of second brushes are arranged perpendicular to the substrate or formed a second angle with the substrate. According to the present invention, the polishing pad conditioning device can clean the polishing pads with different hardness, and can effectively remove residual debris in the grooves of the polishing pad, thereby achieving better cleaning ability.
Bibliography:Application Number: TW20230101428