Metal plating composition and method of using the same

• Main Authors: SHEN, SPRING MENG-HAN, PENG, HONG-XIU, SUN, PENG
• Format: Patent
• Language: Chinese; English
• Published: 01.07.2024
• Subjects: APPARATUS THEREFOR; CHEMISTRY; ELECTROFORMING; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; METALLURGY; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS

The present invention provides a metal plating composition comprising a leveling agent, wherein the leveling agent is a compound of formula (I):, R1 is selected from alkyl and aryl groups; R2 is selected from alkyl and aryl groups; R3 is selected from alkyl and aryl groups; n is an arbitrary integer...