Metal plating composition and method of using the same

The present invention provides a metal plating composition comprising a leveling agent, wherein the leveling agent is a compound of formula (I):, R1 is selected from alkyl and aryl groups; R2 is selected from alkyl and aryl groups; R3 is selected from alkyl and aryl groups; n is an arbitrary integer...

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Bibliographic Details
Main Authors SHEN, SPRING MENG-HAN, PENG, HONG-XIU, SUN, PENG
Format Patent
LanguageChinese
English
Published 01.07.2024
Subjects
APPARATUS THEREFOR
CHEMISTRY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
METALLURGY
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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Summary:The present invention provides a metal plating composition comprising a leveling agent, wherein the leveling agent is a compound of formula (I):, R1 is selected from alkyl and aryl groups; R2 is selected from alkyl and aryl groups; R3 is selected from alkyl and aryl groups; n is an arbitrary integer ranging from 1 to 1500. With the aforementioned technological scheme, it is possible to achieve technical effects such as no holes or defects, low coating impurities, good uniform plating, dense structure, and small surface roughness. The metal plating composition can have good thermal reliability and uniform plating capability, which can solve the problem of sealing the hole opening, where "hole opening" refers to concave features including through-holes and blind channels. This composition has good industrial application value.
Bibliography:Application Number: TW202312150448