Manufacturing method of housing structure of electronic device

A manufacturing method of housing structure of electronic device is provided. The manufacturing method includes stacking a first structural layer, a painting layer, and a second structural layer, wherein the painting layer is located between the first and the second structural layers. The layer stac...

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Bibliographic Details
Main Authors LING, CHENG-NAN, HUANG, CHANG-HUANG, TAI, WENIEH, LIN, PINUEH
Format Patent
LanguageChinese
English
Published 16.04.2024
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
DECORATIVE ARTS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
MOSAICS
PAPERHANGING
PERFORMING OPERATIONS
PRINTED CIRCUITS
PRODUCING DECORATIVE EFFECTS
TARSIA WORK
TRANSPORTING
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Summary:A manufacturing method of housing structure of electronic device is provided. The manufacturing method includes stacking a first structural layer, a painting layer, and a second structural layer, wherein the painting layer is located between the first and the second structural layers. The layer stacked after the painting layer washes and squeezes at least a portion of the flowing painting layer to form a random texture pattern.
Bibliography:Application Number: TW202211137722