Plastic package cavity structure and manufacturing method thereof

• Main Authors: FENG, LEI, HUANG, BEN-XIA, ZHAO, JIANG-JIANG, HONG, YE-JIE, HUANG, GAO, CHEN, XIAN-MING
• Format: Patent
• Language: Chinese; English
• Published: 16.04.2024
• Subjects: MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES; MICROSTRUCTURAL TECHNOLOGY; PERFORMING OPERATIONS; PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS; TRANSPORTING

The invention provides a plastic packaging cavity structure and a manufacturing method thereof. The plastic packaging cavity structure comprises an embedded packaging frame which is provided with a first cavity and a first conduction column, wherein the first cavity and the first conduction column penetrate through an insulating layer in the height direction; the chip set is arranged in the first cavity; the first circuit layer is arranged on the upper surface of the embedded packaging frame; the first dielectric layer is arranged on the first circuit layer; the second circuit layer is arranged on the first dielectric layer; the through hole penetrates through the first dielectric layer and the insulating layer; the third circuit layer is arranged on the lower surface of the embedded packaging frame; the supporting column enclosing wall is arranged on the third circuit layer; the plastic packaging layer is formed along the outer side of the enclosing wall of the supporting column; wherein a second cavity comm