Surface-treated copper foil, copper-clad laminate plate, and printed wiring board
Provided is a surface-treated copper foil having a copper foil and a surface-treatment layer formed on at least one surface of the copper foil. The surface-treatment layer has a peak material volume Vmp of 0.010-0.080 [mu]m3/[mu]m2 and has a Zn deposition amount of 10-250 [mu]g/dm2.
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| Main Authors | , , |
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| Format | Patent |
| Language | Chinese English |
| Published |
01.04.2024
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| Subjects | |
| Online Access | Get full text |
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| Abstract | Provided is a surface-treated copper foil having a copper foil and a surface-treatment layer formed on at least one surface of the copper foil. The surface-treatment layer has a peak material volume Vmp of 0.010-0.080 [mu]m3/[mu]m2 and has a Zn deposition amount of 10-250 [mu]g/dm2. |
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| AbstractList | Provided is a surface-treated copper foil having a copper foil and a surface-treatment layer formed on at least one surface of the copper foil. The surface-treatment layer has a peak material volume Vmp of 0.010-0.080 [mu]m3/[mu]m2 and has a Zn deposition amount of 10-250 [mu]g/dm2. |
| Author | KUSUNOKI, KEISUKE KOMURA, TOSHIYUKI IWASAKI, YUICHI |
| Author_xml | – fullname: KUSUNOKI, KEISUKE – fullname: IWASAKI, YUICHI – fullname: KOMURA, TOSHIYUKI |
| BookMark | eNrjYmDJy89L5WQIDC4tSktMTtUtKUpNLElNUUjOLyhILVJIy8_M0YFydJNzElMUchJzM_OAShQKcoCkjkJiXopCQVFmHkhTeSaQka6QlJ9YlMLDwJqWmFOcyguluRkU3VxDnD10Uwvy41OLC4CW5aWWxIeEGxkYmRiaGpqaORoTowYA0aY5FA |
| ContentType | Patent |
| DBID | EVB |
| DatabaseName | esp@cenet |
| DatabaseTitleList | |
| Database_xml | – sequence: 1 dbid: EVB name: esp@cenet url: http://worldwide.espacenet.com/singleLineSearch?locale=en_EP sourceTypes: Open Access Repository |
| DeliveryMethod | fulltext_linktorsrc |
| Discipline | Medicine Chemistry Sciences |
| ExternalDocumentID | TW202415156A |
| GroupedDBID | EVB |
| ID | FETCH-epo_espacenet_TW202415156A3 |
| IEDL.DBID | EVB |
| IngestDate | Fri Jul 19 12:46:38 EDT 2024 |
| IsOpenAccess | true |
| IsPeerReviewed | false |
| IsScholarly | false |
| Language | Chinese English |
| LinkModel | DirectLink |
| MergedId | FETCHMERGED-epo_espacenet_TW202415156A3 |
| Notes | Application Number: TW202312133466 |
| OpenAccessLink | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240401&DB=EPODOC&CC=TW&NR=202415156A |
| ParticipantIDs | epo_espacenet_TW202415156A |
| PublicationCentury | 2000 |
| PublicationDate | 20240401 |
| PublicationDateYYYYMMDD | 2024-04-01 |
| PublicationDate_xml | – month: 04 year: 2024 text: 20240401 day: 01 |
| PublicationDecade | 2020 |
| PublicationYear | 2024 |
| RelatedCompanies | JX METALS CORPORATION |
| RelatedCompanies_xml | – name: JX METALS CORPORATION |
| Score | 3.6681287 |
| Snippet | Provided is a surface-treated copper foil having a copper foil and a surface-treatment layer formed on at least one surface of the copper foil. The... |
| SourceID | epo |
| SourceType | Open Access Repository |
| SubjectTerms | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
| Title | Surface-treated copper foil, copper-clad laminate plate, and printed wiring board |
| URI | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240401&DB=EPODOC&locale=&CC=TW&NR=202415156A |
| hasFullText | 1 |
| inHoldings | 1 |
| isFullTextHit | |
| isPrint | |
| link | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfR1dT8Iw8IJo1DdFDeJHamL2RCNsYxsPi5ENQkz4UKfwRtatxBmyLWOExF_vtQ7xRV-afl76db3e9e4KcGs0TFUN2gFlqtWgwoUWtXRNpb5mmHrQYLzVFtbIg6HRf9Ufp61pCT42tjDST-haOkdEjAoQ33N5XqdbIZYrdSuXdyzCrOS-59muUnDHSJ6QX1Dcjt0dj9yRoziO7U2U4bMsE7TbeNiBXXGNFn72u28dYZWS_iYpvSPYGyO0OD-G0ud7BQ6czc9rFdgfFA_eGC1wb3kCTy-rbI59pVI3nIckSNKUZ2SeRIt6kaDBwg8JLnIUYxWSLjCsEz8OiZDfiUbrSAjyCEtwZ5zCTa_rOX2KfZv9TMTMm2yHoZ1BOU5iXgWi6ZgTzlWLIXfEmyZTQ6Y3Ta5zYWfrs3Oo_Q2n9l_hBRyKxLemyiWU82zFr5AI5-xazt4Xb9WLPg |
| link.rule.ids | 230,309,786,891,25594,76906 |
| linkProvider | European Patent Office |
| linkToHtml | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfR1dT8Iw8IJoxDdFDeJXTcyeaIRtbPBAjGwQVL7UKbyRdStxhmwLjJD4673WIb7oS9P22qZf1-td764A10bZVFWv7lGm1spUuNCiNV1TqasZpu6VGa_WhTVyr290XvWHcXWcgY-1LYz0E7qSzhERozzE90Se1_FGiGVL3crFDQswK7ptOw1bSbljJE_ILyh2s9EaDuyBpVhWwxkp_WcJE7TbuNuCbVN45xVXp7emsEqJf5OU9j7sDLG1MDmAzOd7HnLW-ue1POz20gdvjKa4tziEp5flfIp9pVI3nPvEi-KYz8k0CmalNEG9mesTXOQgxCIknmFYIm7oEyG_E5VWgRDkERbhzjiCq3bLsToU-zb5mYiJM9oMQzuGbBiFvABE0zHHn6o1htwRr5hM9ZleMbnOhZ2ty06g-Hc7xf-Al5DrOL3upHvffzyFPQH41lo5g2wyX_JzJMgJu5Az-QUcGY4r |
| openUrl | ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Apatent&rft.title=Surface-treated+copper+foil%2C+copper-clad+laminate+plate%2C+and+printed+wiring+board&rft.inventor=KUSUNOKI%2C+KEISUKE&rft.inventor=IWASAKI%2C+YUICHI&rft.inventor=KOMURA%2C+TOSHIYUKI&rft.date=2024-04-01&rft.externalDBID=A&rft.externalDocID=TW202415156A |