Surface-treated copper foil, copper-clad laminate plate, and printed wiring board

Provided is a surface-treated copper foil having a copper foil and a surface-treatment layer formed on at least one surface of the copper foil. The surface-treatment layer has a peak material volume Vmp of 0.010-0.080 [mu]m3/[mu]m2 and has a Zn deposition amount of 10-250 [mu]g/dm2.

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Bibliographic Details
Main Authors KUSUNOKI, KEISUKE, IWASAKI, YUICHI, KOMURA, TOSHIYUKI
Format Patent
LanguageChinese
English
Published 01.04.2024
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:Provided is a surface-treated copper foil having a copper foil and a surface-treatment layer formed on at least one surface of the copper foil. The surface-treatment layer has a peak material volume Vmp of 0.010-0.080 [mu]m3/[mu]m2 and has a Zn deposition amount of 10-250 [mu]g/dm2.
Bibliography:Application Number: TW202312133466