Flaw detection method, terminal device and storage medium

The application proposes a flaw detection method, which is applied to a terminal device, and the terminal device is communication links with the SPI machine. The method includes the following steps: the terminal device acquires the image of the first flaw block output by the SPI machine; Among them,...

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Bibliographic Details
Main Authors YANG, CHENG-JU, TARNG, WAN-HSIN, CHU, TSAI-PING
Format Patent
LanguageChinese
English
Published 01.04.2024
Subjects
INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES
MEASURING
PHYSICS
TESTING
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Summary:The application proposes a flaw detection method, which is applied to a terminal device, and the terminal device is communication links with the SPI machine. The method includes the following steps: the terminal device acquires the image of the first flaw block output by the SPI machine; Among them, the first defective area is the solder paste with unqualified printing obtained after SPI machine detection; The terminal device processes the received image of the first defective block; The terminal device detects whether the solder paste printing in the first defective block is qualified; When the terminal device detects that the solder paste printing of the first defective block is unqualified, it determines that the first defective block is the second defective block, and determines the defect type of the first defective block with unqualified solder paste printing. The application also provides a terminal device and a storage medium for performing the flaw detection method.
Bibliography:Application Number: TW202211136251