Enhanced thermal release adhesive material, structure thereof and manufacturing method thereof

A manufacturing method includes: prefabricating at least one thermal release material; prefabricating at least one HELB (high energy light beam) sensitive material; forming at least one HELB-sensitive thermal release layer with the thermal release material and the HELB sensitive material; providing...

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Bibliographic Details
Main Authors CHEN, BONG, WU, KAI-MING, CHUNG, YIANG, LI, MINN, YANG, YUNGU
Format Patent
LanguageChinese
English
Published 01.04.2024
Subjects
ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
CHEMISTRY
DYES
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
PAINTS
POLISHES
USE OF MATERIALS AS ADHESIVES
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Summary:A manufacturing method includes: prefabricating at least one thermal release material; prefabricating at least one HELB (high energy light beam) sensitive material; forming at least one HELB-sensitive thermal release layer with the thermal release material and the HELB sensitive material; providing at least one HELB operating portion on the HELB-sensitive thermal release layer; and providing at least one reusable adhesive surface on the HELB-sensitive thermal release layer, thereby operating the laser operating portion for alternatively adhering or peeling off the reusable adhesive surface.
Bibliography:Application Number: TW202211135269