Photosensitive resin composition, photosensitive resin layer using the same, color filter and CMOS image sensor

• Main Authors: LEE, YOUNG-TAI, YOO, JEONG-HO, LEE, SANG-HO, KIM, KWANG-SEOP, KIM, ICK-JIN, KIM, IE-JU, KIM, SABINA, PARK, BAEK-SOUNG, CHO, MYUNG-HO, KIM, JI-HYE, KIM, JI-HONG
• Format: Patent
• Language: Chinese; English
• Published: 01.04.2024
• Subjects: ADHESIVES; APPARATUS SPECIALLY ADAPTED THEREFOR; CHEMISTRY; CINEMATOGRAPHY; COMPOSITIONS BASED THEREON; DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING; DYES; ELECTROGRAPHY; FREQUENCY-CHANGING; HOLOGRAPHY; LAKES; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS; MATERIALS THEREFOR; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; MORDANTS; NATURAL RESINS; NON-LINEAR OPTICS; OPTICAL ANALOGUE/DIGITAL CONVERTERS; OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS; OPTICAL LOGIC ELEMENTS; OPTICS; ORGANIC DYES OR CLOSELY-RELATED COMPOUNDS FOR PRODUCING DYES; ORGANIC MACROMOLECULAR COMPOUNDS; ORIGINALS THEREFOR; PAINTS; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS; POLISHES; TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF; THEIR PREPARATION OR CHEMICAL WORKING-UP

This disclosure relates to a photosensitive resin composition, a photosensitive resin layer manufactured using the same, a color filter, a CMOS image sensor. Some embodiments provide a photosensitive resin composition including (A) an additive; (B) a binder resin; (C) a photopolymerizable compound; (D) a photopolymerization initiator; (E) a colorant; and (F) a solvent, wherein the additive includes a leveling agent, and the leveling agent is included in an amount of about 15 ppm to about 30 ppm based on a total amount of the photosensitive resin composition.