Semiconductor device

Embodiments provide a semiconductor device. The semiconductor device includes a semiconductor substrate, a first deep well region, at least two second well regions, at least one isolation structure and an implantation region. The first deep well region is disposed in the semiconductor substrate, whe...

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Bibliographic Details
Main Authors CHEN, CHINGUNG, YANG, HSIAO-YING, LAO, CHUNG-REN, LIU, HSINGAO
Format Patent
LanguageChinese
English
Published 16.03.2024
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:Embodiments provide a semiconductor device. The semiconductor device includes a semiconductor substrate, a first deep well region, at least two second well regions, at least one isolation structure and an implantation region. The first deep well region is disposed in the semiconductor substrate, wherein the first deep well region has a first conductive type. The second well regions are disposed on the first deep well region, wherein the second well regions have a second conductive type. The isolation structure covers a portion of the first deep well region and surrounds at least a portion of the second well regions. The implantation region is disposed under a top surface of the semiconductor substrate, wherein the implantation region has a discontinuous portion partially overlaps with the first deep well region.
Bibliography:Application Number: TW202211133101