Manufacturing method of device embedded packaging structure

• Main Authors: HUANG, BEN-XIA, FENG, LEI, FENG, JIN-DONG, HONG, YE-JIE, CHEN, XIAN-MING
• Format: Patent
• Language: Chinese; English
• Published: 01.03.2024
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The invention discloses a manufacturing method of a device embedded packaging structure, which comprises the following steps of: (a) laminating a first dielectric material on at least one surface of a copper foil to form a first dielectric layer, and forming a first characteristic pattern in the first dielectric layer to expose the copper foil; (b) etching the exposed copper foil to form a device opening frame and a through hole column opening frame, thereby obtaining a metal frame; (c) applying a bonding layer on the bottom surface of the metal frame, and mounting a device on the bonding layer in the device opening frame; (d) laminating a second dielectric material to form a second dielectric layer, wherein the second dielectric layer covers the metal frame and fills the device mouth frame and the through hole pillar mouth frame; and (e) forming a through hole column in the through hole column opening frame, and respectively forming a first wiring layer and a second wiring layer which are conducted and conne