Quantum computing apparatus with interposer, method of fabrication thereof, method of performing a quantum computing operation, quantum computing apparatus comprising tantalum nitride and a method of fabrication thereof
The present invention discloses a a quantum computing apparatus. The quantum computing apparatus comprises a substrate layer and a patterned layer adjacent and parallel to the substrate layer such that the substrate layer and the patterned layer form a layer stack. The patterned layer comprises an e...
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Main Authors | , , |
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Format | Patent |
Language | Chinese English |
Published |
01.03.2024
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Subjects | |
Online Access | Get full text |
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Summary: | The present invention discloses a a quantum computing apparatus. The quantum computing apparatus comprises a substrate layer and a patterned layer adjacent and parallel to the substrate layer such that the substrate layer and the patterned layer form a layer stack. The patterned layer comprises an electrically conductive material. The layer stack forms multiple qubits. The quantum computing apparatus further comprises an interposer comprising a rigid connection element mechanically connected to the layer stack, wherein the connection element is substantially planar and positioned in a non-parallel plane to the plane in which the substrate layer is formed, and wherein the connection element comprises a conductive element formed on or in the connection element, preferably a transmission line, for providing an electrical connection to the patterned layer. |
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Bibliography: | Application Number: TW202312104792 |