Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for producing semiconductor package or rinted wiring board

This photosensitive resin composition contains (A) a binder polymer, (B) a photopolymerizable compound having an ethylenically unsaturated bond, and (C) a photopolymerization initiator, wherein the absorbance of the photosensitive resin composition with respect to light having a wavelength of 365 nm...

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Bibliographic Details
Main Authors TODA, NATSUKI, KAGUCHI, YOSUKE, KATO, TETSUYA, IWASHITA, KENICHI, ONO, HIROSHI, KURODA, AYAKA
Format Patent
LanguageChinese
English
Published 01.03.2024
Subjects
APPARATUS SPECIALLY ADAPTED THEREFOR
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CHEMISTRY
CINEMATOGRAPHY
COMPOSITIONS BASED THEREON
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROGRAPHY
HOLOGRAPHY
MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
MATERIALS THEREFOR
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
PRINTED CIRCUITS
THEIR PREPARATION OR CHEMICAL WORKING-UP
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Summary:This photosensitive resin composition contains (A) a binder polymer, (B) a photopolymerizable compound having an ethylenically unsaturated bond, and (C) a photopolymerization initiator, wherein the absorbance of the photosensitive resin composition with respect to light having a wavelength of 365 nm per 1 [mu]m of thickness is greater than 0.0041 and less than or equal to 0.0130.
Bibliography:Application Number: TW202312124675