Baking type conductive paste

• Main Authors: NAKASHIMA, HIROMICHI, TERUYA, SEIYU
• Format: Patent
• Language: Chinese; English
• Published: 16.02.2024
• Subjects: ADHESIVES; BASIC ELECTRIC ELEMENTS; CABLES; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMICAL PAINT OR INK REMOVERS; CHEMISTRY; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS; CONDUCTORS; CORRECTING FLUIDS; DYES; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FILLING PASTES; INKS; INSULATORS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; PAINTS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; POLISHES; PRINTED CIRCUITS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES; USE OF MATERIALS THEREFOR; WOODSTAINS

The present invention provides a baking type conductive paste which is capable of forming a plate-like conductor film that is flat and smooth, while being thick and large in size. A baking type conductive paste according to one embodiment of the present invention is characterized by containing a conductive powder that is mainly composed of nickel and has an average particle diameter D50 of 0.05 [mu]m to 1.0 [mu]m, an acrylic resin that has an acid value of 0 mgKOH/g to 10 mgKOH/g, and an organic solvent in which the acrylic resin is dissolved, and is also characterized in that: the organic solvent is an alcohol-based solvent having 3 or more carbon atoms and a boiling point of 300 DEG C or less; and the water content in the paste is less than 0.50% by mass.