Cleaning composition for adhesives

One embodiment of the present invention provides a cleaning composition for adhesives, the cleaning composition exhibiting excellent removability of adhesives. One embodiment of the present disclosure relates to a cleaning composition for removing an adhesive that remains on a wafer. This cleaning c...

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Bibliographic Details
Main Author YAMADA, KOUHEI
Format Patent
LanguageChinese
English
Published 16.02.2024
Subjects
ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES
BASIC ELECTRIC ELEMENTS
CANDLES
CHEMISTRY
CLEANING
CLEANING IN GENERAL
DETERGENT COMPOSITIONS
DETERGENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FATTY ACIDS THEREFROM
METALLURGY
PERFORMING OPERATIONS
PREVENTION OF FOULING IN GENERAL
RECOVERY OF GLYCEROL
RESIN SOAPS
SEMICONDUCTOR DEVICES
SOAP OR SOAP-MAKING
TRANSPORTING
USE OF SINGLE SUBSTANCES AS DETERGENTS
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Summary:One embodiment of the present invention provides a cleaning composition for adhesives, the cleaning composition exhibiting excellent removability of adhesives. One embodiment of the present disclosure relates to a cleaning composition for removing an adhesive that remains on a wafer. This cleaning composition for adhesives contains an organic solvent (component A) and a surfactant (component B); the component B is composed of at least one surfactant that is selected from among fluorine-based surfactants and silicone-based surfactants; the content of the component A is 90% by mass to 99.97% by mass; and the content of the component B is 0.03% by mass to 5% by mass.
Bibliography:Application Number: TW202312119722