Substrate processing apparatus, substrate processing method and recording medium

To increase the dimensional stability of a resist pattern arranged by use of a metal-containing resist. A substrate processing apparatus includes a film forming processing unit configured to form a metal-containing resist film on a substrate; a heat treatment unit configured to perform a heating pro...

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Bibliographic Details
Main Authors ENOMOTO, MASASHI, YAMAUCHI, TAKASHI, MIZUNOURA, HIROSHI, SANO, YOHEI, KAWAKAMI, SHINICHIRO
Format Patent
LanguageChinese
English
Published 16.01.2024
Subjects
APPARATUS SPECIALLY ADAPTED THEREFOR
CINEMATOGRAPHY
ELECTROGRAPHY
HOLOGRAPHY
MATERIALS THEREFOR
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
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Summary:To increase the dimensional stability of a resist pattern arranged by use of a metal-containing resist. A substrate processing apparatus includes a film forming processing unit configured to form a metal-containing resist film on a substrate; a heat treatment unit configured to perform a heating processing on the substrate on which the film is formed and in which an exposure processing is performed on the film; a developing processing unit configured to perform a developing processing on the film formed on the substrate on which the heating processing is performed; and an adjustment controller configured to reduce a difference between substrates in an amount of water that reacts in the film formed on the substrate during the heating processing.
Bibliography:Application Number: TW202312136588