Wafer washing system and operation method thereof
The present invention discloses a wafer washing system and an operation method thereof. The wafer washing system includes: a washing chamber; a wafer stage device arranged in the washing chamber; a liquid-film generation spray device; a functional-water feeding device, an output end of which is conn...
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Main Authors | , , , , |
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Format | Patent |
Language | Chinese English |
Published |
16.01.2024
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Subjects | |
Online Access | Get full text |
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Summary: | The present invention discloses a wafer washing system and an operation method thereof. The wafer washing system includes: a washing chamber; a wafer stage device arranged in the washing chamber; a liquid-film generation spray device; a functional-water feeding device, an output end of which is connected with an input end of the liquid-film generation spray device, and a washing spray device. The functional-water feeding device is used to feed a liquid mixed with functional gas. The washing spray device is used to spray a cleaning solution. In the present application, by the liquid-film generation spray device, the wafer is sprayed with the liquid mixed with functional gas in the functional-water feeding device before the main washing operation, so that the wafer surface is formed with a wet interface that is easy to be covered by the chemical cleaning solution while a part of pollutants are removed, thus improving the cleaning effect of the chemical cleaning solution at the spraying site of the subsequent cl |
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Bibliography: | Application Number: TW202312109834 |