Photo-curing protection tape and processing method

A photo-curing protection tape includes a substrate and a photo-curing adhesive layer. The photo-curing adhesive layer is blanketed on the substrate. The raw materials for forming the photo-curing adhesive layer include oligomers. The oligomers have a weight average molecular weight of 1,000 to 100,...

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Bibliographic Details
Main Authors LIN, CHIN-KAI, HUANG, CHI-HUA, CHEN, CHUN-FA, XIE, SHI-ROU, CHEN, XUAN-YOU, LEE, CHEN-JU
Format Patent
LanguageChinese
English
Published 01.01.2024
Subjects
ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
BASIC ELECTRIC ELEMENTS
CHEMISTRY
DYES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
PAINTS
POLISHES
SEMICONDUCTOR DEVICES
USE OF MATERIALS AS ADHESIVES
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Summary:A photo-curing protection tape includes a substrate and a photo-curing adhesive layer. The photo-curing adhesive layer is blanketed on the substrate. The raw materials for forming the photo-curing adhesive layer include oligomers. The oligomers have a weight average molecular weight of 1,000 to 100,000. The hardness of the photo-curing adhesive layer is less than the Shore 50E2 at 23 degrees Celsius.
Bibliography:Application Number: TW202211124140