Flexible metal clad laminate, method for manufacturing the same, and flexible printed circuit board using the flexible metal clad laminate

The present disclosure relates to a roll-shaped flexible metal laminate, a manufacturing method thereof, and a flexible printed circuit board. The manufacturing method includes the following steps: preparing a first resin composition containing a first high heat-resistant adhesive, a first fluorores...

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Bibliographic Details
Main Authors SEO, HYEON-JIN, HAN, GA-YOUNG, LEE, JIN-SOO
Format Patent
LanguageChinese
English
Published 01.12.2023
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:The present disclosure relates to a roll-shaped flexible metal laminate, a manufacturing method thereof, and a flexible printed circuit board. The manufacturing method includes the following steps: preparing a first resin composition containing a first high heat-resistant adhesive, a first fluororesin filler and a first organic solvent and a second resin composition that is the same as or different from the first resin composition and containing a second high heat-resistant adhesive, a second fluororesin filler, and a second organic solvent; coating the first resin composition on one side of a first metal foil, and drying it to prepare a roll-shaped first unit member; coating the second resin composition on one side of a second metal foil, and drying it to prepare a roll-shaped second unit member; laminating the first and second unit members on both sides of a fiber-containing substrate so that the composition film of each unit member is in contact with a surface of the fiber-containing substrate, and then ap
Bibliography:Application Number: TW202312105704