Semiconductor package and manufacturing method thereof
A semiconductor package and a manufacturing method thereof is provided. The semiconductor package includes a first semiconductor die, including a substrate and transistors formed at a front side of the substrate; a power distribution network, spreading at a back side of the substrate and penetrating...
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| Main Authors | , , , |
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| Format | Patent |
| Language | Chinese English |
| Published |
01.12.2023
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| Subjects | |
| Online Access | Get full text |
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| Abstract | A semiconductor package and a manufacturing method thereof is provided. The semiconductor package includes a first semiconductor die, including a substrate and transistors formed at a front side of the substrate; a power distribution network, spreading at a back side of the substrate and penetrating through the substrate, to provide power and ground signals to the transistors; a dielectric material, laterally surrounding the first semiconductor die; and a second semiconductor die, having a central portion bonded with the first semiconductor die and a peripheral portion in contact with the dielectric material. |
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| AbstractList | A semiconductor package and a manufacturing method thereof is provided. The semiconductor package includes a first semiconductor die, including a substrate and transistors formed at a front side of the substrate; a power distribution network, spreading at a back side of the substrate and penetrating through the substrate, to provide power and ground signals to the transistors; a dielectric material, laterally surrounding the first semiconductor die; and a second semiconductor die, having a central portion bonded with the first semiconductor die and a peripheral portion in contact with the dielectric material. |
| Author | KUO, HUNG-YI YU, CHEN-HUA HSIEH, CHENGIEH YEE, KUOUNG |
| Author_xml | – fullname: YEE, KUOUNG – fullname: HSIEH, CHENGIEH – fullname: KUO, HUNG-YI – fullname: YU, CHEN-HUA |
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| Notes | Application Number: TW202312101545 |
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| RelatedCompanies | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD |
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| Snippet | A semiconductor package and a manufacturing method thereof is provided. The semiconductor package includes a first semiconductor die, including a substrate and... |
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| SubjectTerms | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| Title | Semiconductor package and manufacturing method thereof |
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