A heat spreader, and an electronic module

• Main Authors: INGELHAG, PER, MELIN, PETER
• Format: Patent
• Language: Chinese; English
• Published: 01.12.2023
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

The present invention relates to a heat spreader (100) for heat transfer from a heat generating electronic component (201) having a coefficient of thermal expansion, CTEX wherein the heat spreader (100) comprises a plate (101) of a first thermally conductive material with a first side (102) configured to be in thermal contact with the heat generating electronic component (201), and an opposing second side (103), wherein the first thermally conductive material has a first coefficient of thermal expansion, CTE1; a plurality of holes (106;404,405;504) extending in a direction between the first side (102) and the second side (103) of the plate (101), wherein the plurality of holes are disposed in the first region (105) of the plate (101); a second thermally conductive material (104) with a second coefficient of thermal expansion, CTE2, disposed in said holes (106;405,404;504); wherein the heat spreader (100) has a thermal expansion coefficient CTEC in the first region (105) which is based on the volume, V1, of th