A heat spreader, and an electronic module

The present invention relates to a heat spreader (100) for heat transfer from a heat generating electronic component (201) having a coefficient of thermal expansion, CTEX wherein the heat spreader (100) comprises a plate (101) of a first thermally conductive material with a first side (102) configur...

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Bibliographic Details
Main Authors INGELHAG, PER, MELIN, PETER
Format Patent
LanguageChinese
English
Published 01.12.2023
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Summary:The present invention relates to a heat spreader (100) for heat transfer from a heat generating electronic component (201) having a coefficient of thermal expansion, CTEX wherein the heat spreader (100) comprises a plate (101) of a first thermally conductive material with a first side (102) configured to be in thermal contact with the heat generating electronic component (201), and an opposing second side (103), wherein the first thermally conductive material has a first coefficient of thermal expansion, CTE1; a plurality of holes (106;404,405;504) extending in a direction between the first side (102) and the second side (103) of the plate (101), wherein the plurality of holes are disposed in the first region (105) of the plate (101); a second thermally conductive material (104) with a second coefficient of thermal expansion, CTE2, disposed in said holes (106;405,404;504); wherein the heat spreader (100) has a thermal expansion coefficient CTEC in the first region (105) which is based on the volume, V1, of th
Bibliography:Application Number: TW202211148411