Wafer and wafer processing method in which a plurality of semiconductor chips is obtained by performing an expansion process after forming a modified region along the line

This invention relates to a wafer and a wafer processing method. The wafer is a wafer in which a plurality of semiconductor chips is obtained by performing an expansion process after forming a modified region along the line. The wafer has a plurality of chip-formed regions divided by chip dividing l...

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Bibliographic Details
Main Authors SAKAMOTO, TAKESHI, NAGURA, KEISUKE, YAMAMOTO, KAZUMA
Format Patent
LanguageChinese
English
Published 01.12.2023
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:This invention relates to a wafer and a wafer processing method. The wafer is a wafer in which a plurality of semiconductor chips is obtained by performing an expansion process after forming a modified region along the line. The wafer has a plurality of chip-formed regions divided by chip dividing lines as lines. The chip-formed region has a chip portion, which constitutes a semiconductor chip; and a dicing portion, which is a portion cut from the chip portion and is continuous with the chip portion via an opening line. The opening line is a line set so as to form a slit-shaped opening portion on the semiconductor chip, and the opening line is set such that the width of the opening portion expands toward the opening end side or becomes constant.
Bibliography:Application Number: TW202312117113