Low oxygen scanning UV source with localized purge

• Main Authors: GODET, LUDOVIC, CHIDAMBARAM, MAHENDRAN, ACHARYA, SUMEDH DATTATRAYA, ZHANG, DAI-HUA, KEMP, MICHAEL DAVID-SCOTT
• Format: Patent
• Language: Chinese; English
• Published: 01.11.2023
• Subjects: APPARATUS SPECIALLY ADAPTED THEREFOR; CINEMATOGRAPHY; COLOUR PRINTING; ELECTROGRAPHY; HOLOGRAPHY; LINING MACHINES; MATERIALS THEREFOR; ORIGINALS THEREFOR; PERFORMING OPERATIONS; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS; PRINTING; PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; STAMPS; TRANSPORTING; TYPEWRITERS

A method and apparatus for curing a substrate are described. The apparatus includes a curing apparatus with a casing and an ultraviolet (UV) radiation assembly coupled to the casing. The ultraviolet radiation assembly further includes a line UV radiation source. The casing includes an opening on one end. A substrate passes by the opening and is exposed to the UV radiation of the line UV radiation source. The curing apparatus further includes a purge assembly configured to continuously purge the process volume and the volume directly above the exposed portion of the substrate. The curing apparatus is configured to only cure a portion of the substrate at any one point in time, such that the curing apparatus is a scanning curing apparatus and includes a small process volume.