Low oxygen scanning UV source with localized purge

A method and apparatus for curing a substrate are described. The apparatus includes a curing apparatus with a casing and an ultraviolet (UV) radiation assembly coupled to the casing. The ultraviolet radiation assembly further includes a line UV radiation source. The casing includes an opening on one...

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Bibliographic Details
Main Authors GODET, LUDOVIC, CHIDAMBARAM, MAHENDRAN, ACHARYA, SUMEDH DATTATRAYA, ZHANG, DAI-HUA, KEMP, MICHAEL DAVID-SCOTT
Format Patent
LanguageChinese
English
Published 01.11.2023
Subjects
APPARATUS SPECIALLY ADAPTED THEREFOR
CINEMATOGRAPHY
COLOUR PRINTING
ELECTROGRAPHY
HOLOGRAPHY
LINING MACHINES
MATERIALS THEREFOR
ORIGINALS THEREFOR
PERFORMING OPERATIONS
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
PRINTING
PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES
STAMPS
TRANSPORTING
TYPEWRITERS
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Summary:A method and apparatus for curing a substrate are described. The apparatus includes a curing apparatus with a casing and an ultraviolet (UV) radiation assembly coupled to the casing. The ultraviolet radiation assembly further includes a line UV radiation source. The casing includes an opening on one end. A substrate passes by the opening and is exposed to the UV radiation of the line UV radiation source. The curing apparatus further includes a purge assembly configured to continuously purge the process volume and the volume directly above the exposed portion of the substrate. The curing apparatus is configured to only cure a portion of the substrate at any one point in time, such that the curing apparatus is a scanning curing apparatus and includes a small process volume.
Bibliography:Application Number: TW202211150543