Semiconductor device and methods of fabrication thereof

• Main Authors: NIAN, JUN-NAN, TSAI, JIAN-SHIN, CHUNG, MINGING, LIANG, YAO-HSIANG, LIAO, CHUN-I
• Format: Patent
• Language: Chinese; English
• Published: 16.10.2023
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

Embodiments of the present disclosure relate to methods of fabricating conductive features to prevent metal extrusion. Particularly, the conductive feature includes a control layer to reduce grain size of a metal containing layer, thus obtaining a robust structure to decrease extrusion defects. In s...