Method of fabrication of demountable substrates and assembly for fabricating demountable substrates

Method for fabrication of demountable substrates (1, 2), including the steps of: (a) procuring: - a first substrate (1) including implanted species (10) forming a plane implantation zone (100) and a proximal surface (S); - a second substrate (2) having a surface (20); (b) forming a set of cavities (...

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Bibliographic Details
Main Authors DARRAS, FRANCOIS-XAVIER, BERRE, GUILLAUME, SALVETAT, THIERRY
Format Patent
LanguageChinese
English
Published 16.10.2023
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:Method for fabrication of demountable substrates (1, 2), including the steps of: (a) procuring: - a first substrate (1) including implanted species (10) forming a plane implantation zone (100) and a proximal surface (S); - a second substrate (2) having a surface (20); (b) forming a set of cavities (200) on the proximal surface (S) of the first substrate (1) and/or on the surface (20) of the second substrate (2); (c) assembling the first and second substrates (1, 2) by direct bonding; (d) applying heat treatment to weaken the plane implantation zone (100); the set of cavities (200) being arranged in such a manner as: - to allow direct bonding between the first and second substrates (1, 2) in step (c); - to prohibit thermal initiation of splitting of the plane implantation zone (100) weakened after step (d).
Bibliography:Application Number: TW20220149667