Dicyclopentadiene-based resin, dicyclopentadiene-based hydrogenated resin, and adhesive resin composition including the same

Provided is a dicyclopentadiene-based resin prepared by copolymerizing a monomer composition including dicyclopentadiene-based monomer and a vinylamide-based monomer, having excellent compatibility with a base resin, a dicyclopentadiene-based hydrogenated resin, and an adhesive resin composition inc...

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Bibliographic Details
Main Authors KANG, HYEON-UK, BYUN, DO-HYUN, YOON, KYONG-JUN
Format Patent
LanguageChinese
English
Published 16.10.2023
Subjects
ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
CHEMISTRY
COMPOSITIONS BASED THEREON
DYES
MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
ORGANIC MACROMOLECULAR COMPOUNDS
PAINTS
POLISHES
THEIR PREPARATION OR CHEMICAL WORKING-UP
USE OF MATERIALS AS ADHESIVES
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Summary:Provided is a dicyclopentadiene-based resin prepared by copolymerizing a monomer composition including dicyclopentadiene-based monomer and a vinylamide-based monomer, having excellent compatibility with a base resin, a dicyclopentadiene-based hydrogenated resin, and an adhesive resin composition including the same.
Bibliography:Application Number: TW202312123120