Method for manufacturing shielded printed wiring board and shielded printed wiring board

• Main Authors: TAJIMA, HIROSHI, YAMAUCHI, SIROU, HARUNA, YUUSUKE, KATSUKI, TAKAHIKO
• Format: Patent
• Language: Chinese; English
• Published: 01.10.2023
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PERFORMING OPERATIONS; PRINTED CIRCUITS; TRANSPORTING

Provided is a method of producing a shielded printed wiring board capable of sufficiently adhering to each other a printed wiring board, an adhesive layer of an electromagnetic wave shielding film on one face of the printed wiring board, and an adhesive layer of an electromagnetic wave shielding fil...