Method for manufacturing shielded printed wiring board and shielded printed wiring board

• Main Authors: TAJIMA, HIROSHI, YAMAUCHI, SIROU, HARUNA, YUUSUKE, KATSUKI, TAKAHIKO
• Format: Patent
• Language: Chinese; English
• Published: 01.10.2023
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PERFORMING OPERATIONS; PRINTED CIRCUITS; TRANSPORTING

Provided is a method of producing a shielded printed wiring board capable of sufficiently adhering to each other a printed wiring board, an adhesive layer of an electromagnetic wave shielding film on one face of the printed wiring board, and an adhesive layer of an electromagnetic wave shielding film on the other face of the printed wiring board. The method of producing a shielded printed wiring board of the present invention includes a printed wiring board preparing step of preparing a printed wiring board including a base film, a printed circuit formed on the base film, and a coverlay covering the printed circuit; a first electromagnetic wave shielding film preparing step of preparing a first electromagnetic wave shielding film sequentially including a first protective film, a first insulating layer, and a first adhesive layer; a second electromagnetic wave shielding film preparing step of preparing a second electromagnetic wave shielding film sequentially including a second protective film, a second insula