Ball grid array package for use in touch panel controller and touch panel device utilizing the same

A ball grid array (BGA) package for use in a touch panel controller includes a package substrate and a plurality of solder bumps. The plurality of solder bumps are disposed on the package substrate, arranged in a staggered pattern surrounding a hollow region on the package substrate, and coupled to...

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Bibliographic Details
Main Authors HUANG, JU-LIN, LIN, YUNGNG, LI, TSUNG-LING
Format Patent
LanguageChinese
English
Published 16.09.2023
Subjects
BASIC ELECTRIC ELEMENTS
CALCULATING
COMPUTING
COUNTING
ELECTRIC DIGITAL DATA PROCESSING
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
PHYSICS
SEMICONDUCTOR DEVICES
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Summary:A ball grid array (BGA) package for use in a touch panel controller includes a package substrate and a plurality of solder bumps. The plurality of solder bumps are disposed on the package substrate, arranged in a staggered pattern surrounding a hollow region on the package substrate, and coupled to electrodes of a touch panel via a multi-layer circuit board. The staggered pattern includes Ys1 top rows and Ys2 bottom rows, a minimum vertical distance between centers of two vertically adjacent solder bumps in the Ys1 top rows and the Ys2 bottom rows being referred to as an equivalent vertical pitch, and Ys1, Ys2 being integers exceeding 2. The hollow region has a minimum length defined by the minimum length = ((Ys1-2)+(Ys2-2))*the equivalent vertical pitch.
Bibliography:Application Number: TW202312102329