Protection tape and grinding method

• Main Authors: LIN, CHIN-KAI, HUANG, CHI-HUA, CHEN, CHUN-FA, XIE, SHI-ROU, CHEN, XUAN-YOU, LEE, CHEN-JU
• Format: Patent
• Language: Chinese; English
• Published: 16.09.2023
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; BASIC ELECTRIC ELEMENTS; CHEMISTRY; DYES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; PERFORMING OPERATIONS; POLISHES; SEMICONDUCTOR DEVICES; TRANSPORTING; USE OF MATERIALS AS ADHESIVES

A protection tape includes a substrate, an adhesive layer and a warpage suppression layer. The warpage suppression layer is located between the substrate and the adhesive layer. The warpage suppression layer has a first coefficient of thermal expansion at a grinding process temperature. The protection tape after has a second coefficient of thermal expansion at a peeling process temperature after being irradiated to reduce stickiness. The grinding process temperature is lower than the peeling process temperature. The first coefficient of thermal expansion is smaller than the second coefficient of thermal expansion. The second coefficient of thermal expansion is greater than 10 [mu]m/m DEG C.