Protection tape and grinding method

A protection tape includes a substrate, an adhesive layer and a warpage suppression layer. The warpage suppression layer is located between the substrate and the adhesive layer. The warpage suppression layer has a first coefficient of thermal expansion at a grinding process temperature. The protecti...

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Bibliographic Details
Main Authors LIN, CHIN-KAI, HUANG, CHI-HUA, CHEN, CHUN-FA, XIE, SHI-ROU, CHEN, XUAN-YOU, LEE, CHEN-JU
Format Patent
LanguageChinese
English
Published 16.09.2023
Subjects
ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
BASIC ELECTRIC ELEMENTS
CHEMISTRY
DYES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
PAINTS
PERFORMING OPERATIONS
POLISHES
SEMICONDUCTOR DEVICES
TRANSPORTING
USE OF MATERIALS AS ADHESIVES
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Summary:A protection tape includes a substrate, an adhesive layer and a warpage suppression layer. The warpage suppression layer is located between the substrate and the adhesive layer. The warpage suppression layer has a first coefficient of thermal expansion at a grinding process temperature. The protection tape after has a second coefficient of thermal expansion at a peeling process temperature after being irradiated to reduce stickiness. The grinding process temperature is lower than the peeling process temperature. The first coefficient of thermal expansion is smaller than the second coefficient of thermal expansion. The second coefficient of thermal expansion is greater than 10 [mu]m/m DEG C.
Bibliography:Application Number: TW202211107741