Multi-station processing module and reactor architecture

A multi-station processing module for processing substrates includes at least one substrate handoff station arranged in a first transfer plane. The at least one substrate handoff station is configured to perform a handoff of at least one substrate of a plurality of substrates. The multi-station proc...

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Bibliographic Details
Main Author LEESER, KARL FREDERICK
Format Patent
LanguageChinese
English
Published 01.09.2023
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A multi-station processing module for processing substrates includes at least one substrate handoff station arranged in a first transfer plane. The at least one substrate handoff station is configured to perform a handoff of at least one substrate of a plurality of substrates. The multi-station processing module further includes a plurality of substrate processing stations arranged in a second transfer plane around a substrate transfer region. The second transfer plane is arranged parallel to and offset from the first transfer plane. Each of the plurality of substrate processing stations is configured to process one or more of the plurality of substrates. The multi-station processing module further includes a robot arranged in the substrate transfer region. The robot is configured to move the one or more of the plurality of substrates between the first transfer plane and the second transfer plane during the handoff.
Bibliography:Application Number: TW202211137497