Negative photosensitive composition and pattern forming method containing an epoxy group-containing compound and a cathodic polymerization initiator

The present invention provides a negative photosensitive composition that suppresses a stress of a cured film to a relatively low level and holds the elasticity modulus at a relatively high level, and is not susceptible to undercutting and has an excellent pattern shape, and a patten forming method...

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Bibliographic Details
Main Authors TAKEUCHI, HIROAKI, MASUJIMA, MASAHIRO, IMAI, HIROFUMI, KONDO, TAKAHIRO
Format Patent
LanguageChinese
English
Published 01.09.2023
Subjects
APPARATUS SPECIALLY ADAPTED THEREFOR
CINEMATOGRAPHY
ELECTROGRAPHY
HOLOGRAPHY
MATERIALS THEREFOR
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
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Summary:The present invention provides a negative photosensitive composition that suppresses a stress of a cured film to a relatively low level and holds the elasticity modulus at a relatively high level, and is not susceptible to undercutting and has an excellent pattern shape, and a patten forming method using the same. The present invention is a negative photosensitive composition containing an epoxy group-containing compound (A) and a cathodic polymerization initiator (I), wherein the epoxy group-containing compound (A) comprises an epoxy group-containing compound (AS) that is in a solid state at 25 DEG C and an epoxy group-containing compound (AL) that is in a liquid state at 25 DEG C. The cathodic polymerization initiator (I) comprises a borate salt, and the borate salt contains a cation portion having a thioxanthene skeleton and an anion portion serving as a borate anion.
Bibliography:Application Number: TW202211141567