Photosensitive resin composition, photosensitive resin layer, color filter, and CMOS image sensor
This disclosure relates to a photosensitive resin composition, a photosensitive resin layer using the same, a color filter, and a CMOS image sensor. An embodiment provides a red photosensitive resin composition including (A) a colorant; (B) a binder resin; (C) a photopolymerizable compound; (D) a ph...
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Main Authors | , , , , , , |
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Format | Patent |
Language | Chinese English |
Published |
01.09.2023
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Subjects | |
Online Access | Get full text |
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Summary: | This disclosure relates to a photosensitive resin composition, a photosensitive resin layer using the same, a color filter, and a CMOS image sensor. An embodiment provides a red photosensitive resin composition including (A) a colorant; (B) a binder resin; (C) a photopolymerizable compound; (D) a photopolymerization initiator; and (E) a solvent, wherein the colorant includes a pigment dispersion and the pigment dispersion includes 50 wt% to 80 wt% of C.I. red pigment 254, 20 wt% to 40 wt% of C.I. yellow pigment 139, and 0.1 wt% to 10 wt% of C.I. green pigment 58 based on 100 wt% of a total pigment. This disclosure may implement image quality by the image sensor at a certain level. |
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Bibliography: | Application Number: TW202312107108 |