Systems and methods for two-phase cooling of electronic components

A heat sink includes a body with an expansion chamber therein. The body is configured to receive heat from a heat source. The expansion chamber is configured to expand a working fluid from an inlet port to an outlet port of the heat sink. An immersion system includes a heat sink and a pressurizing m...

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Bibliographic Details
Main Authors KELLEY, DOUGLAS PATRICK, OSEEN-SENDA, KATHRYN M, PETERSON, MARTHA GEOGHEGAN, TRIEU, DENNIS, SCHUBERT, ALEXIS GRACE
Format Patent
LanguageChinese
English
Published 16.08.2023
Subjects
BASIC ELECTRIC ELEMENTS
CALCULATING
COMPUTING
COUNTING
ELECTRIC DIGITAL DATA PROCESSING
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
PHYSICS
SEMICONDUCTOR DEVICES
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Summary:A heat sink includes a body with an expansion chamber therein. The body is configured to receive heat from a heat source. The expansion chamber is configured to expand a working fluid from an inlet port to an outlet port of the heat sink. An immersion system includes a heat sink and a pressurizing mechanism for pressurizing the working fluid prior to the inlet port.
Bibliography:Application Number: TW202211144187