Systems and methods for two-phase cooling of electronic components
A heat sink includes a body with an expansion chamber therein. The body is configured to receive heat from a heat source. The expansion chamber is configured to expand a working fluid from an inlet port to an outlet port of the heat sink. An immersion system includes a heat sink and a pressurizing m...
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Main Authors | , , , , |
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Format | Patent |
Language | Chinese English |
Published |
16.08.2023
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Subjects | |
Online Access | Get full text |
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Summary: | A heat sink includes a body with an expansion chamber therein. The body is configured to receive heat from a heat source. The expansion chamber is configured to expand a working fluid from an inlet port to an outlet port of the heat sink. An immersion system includes a heat sink and a pressurizing mechanism for pressurizing the working fluid prior to the inlet port. |
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Bibliography: | Application Number: TW202211144187 |