Substrate processing device and substrate processing method characterized by observing the frame unit to determine whether the processing is completed after various processes are performed on the substrate of the frame unit

• Main Authors: KIUCHI, HAYATO, SASAKI, SHOHEI, INAKAZU, SUSUMU, YAMAMOTO, NAOKO, ERITATE, MANA, TAJIRI, KAZUTAKA, SAWAKI, SATOSHI, OHKUBO, HIRONARI, SUGIYAMA, TOMOAKI, MATSUDA, TOMOHITO, HORI, SHINICHIRO
• Format: Patent
• Language: Chinese; English
• Published: 16.08.2023
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

To determine whether the processing is completed by observing a frame unit after various processes are performed on a substrate of the frame unit. A substrate processing device 1 is used to process a frame unit 9 that supports the substrate 90 at an opening of a frame 92 by the supporting member 91. The substrate processing device 1 is characterized by comprising: a holding work table 3 that a holding surface 302 used to hold at least one portion of the substrate 90 and the supporting member 91; and a processing unit 16 that processes the frame unit 9 held on the holding work table 3. The holding surface 302 is provided with: a substrate holding region 306 used to hold the substrate 90; a the supporting member holding region 307 used to hold the supporting member 91 exposed between the substrate 90 and the frame 92. The supporting member holding region 307 includes a transfer printing part 308 formed to be a concave shape. By sucking and holding the supporting member 91 on the supporting member holding region