Chip-scale package

• Main Authors: BUENNING, HARTMUT, BERGLUND, STEFAN, KUIPERS, JOHANNES JOSINUS, POELMA, REGNERUS HERMANNUS, SCHNITT, WOLFGANG, FUNKE, HANS-JUERGEN, STOKKERMANS, JOEP
• Format: Patent
• Language: Chinese; English
• Published: 16.08.2023
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

Aspects of the present disclosure relate to a semiconductor device such as a chip-scale package. Aspects of the present disclosure further relate to a method for manufacturing such a device. According to an aspect of the present disclosure, a semiconductor device is provided that comprises a conform...